Thursday, January 26, 2006

Minisymposium on Multiscale Studies of Thin Films and Small Structures, July 16-22, 2006, Los Angeles, California

Computational Mechanics, or more generally, Computational Science, plays an important role in research and practice of integrated structures. This symposium, which inevitably has a focus on computation, also emphasizes integration of experiments and modeling. As part of the 7th World Congress on Computational Mechanics, this is a great opportunity for researchers in the Integrated Structures community to meet with computational experts from worldwide.

To submit your abstract to this symposium, please go to this website.

Deadline for abstract submission: March 15, 2006
Deadline for early registration: February 15, 2006

Monday, January 16, 2006

Views from Industries: Mechanics in Medical Implant Industry

Views from Industries: Mechanics in Medical Implant Industry

Sunday, January 15, 2006

Applied Mechanics News: Applied Mechanics in the Age of Web 2.0

Applied Mechanics News: Applied Mechanics in the Age of Web 2.0

Wednesday, January 11, 2006

Integrated Structures featured in 2006 Gordon Conference

Ting Tsui of Texas Instrument and Jun He of Intel will give two invited talks on "Mechanics of Advanced Interconnect Structures" at the first session of the 2006 Gordon Research Conference of "Thin Film & Small Scale Mechanical Behavior", to be held at Colby College, Waterville, ME, on July 30 - August 4, 2006. The full program of the conference can be found at, which also includes sessions on Small-Scale Biomechanical Behavior, Plasticity and Stresses in Confined Geometries, Interaction between Soft and Hard Materials, and New Vistas of Small-Scale Mechanical Behavior.

Sunday, January 08, 2006

Symposium on Mechanics and Materials of Integrated Structures in Advanced Technologies

To be held at the 2006 ASME International Mechanical Engineering Congress & Exhibition
November 5-10, 2006, Chicago, Illinois.

Abstract Deadline: March 6, 2006

Co-organized by Applied Mechanics Division, Electronic and Photonic Packaging Division, and Materials Division, this symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, microelectromechanical systems, and biomedical devices. The symposium will address fundamental issues in mechanics and materials as well as practical issues for advanced technologies.

Topics of interest include, but not limited to:

  • Reliability of interconnect systems and low-k dielectrics
  • Stability of interconnect structures during processing and packaging
  • Strain engineering for Metal-Oxide Semiconductor (MOS) technology
  • Mechanics of macroelectronics (flexible display, thin-film solar cells, etc.)
  • Multi-field interactions in MEMS/NEMS and biomedical devices
  • Nanomaterials and nanostructures for thermal management
  • Novel mechanical testing methods for integrated small structures
  • Stress generation during manufacturing of integrated structures
  • Stress-induced structural evolution and self assembly at micro/nano-scales

Authors are invited to submit their abstracts online at

Symposium Organizers:

Aman Haque (Penn State Univ,
Jun He (Intel Corp.,
Rui Huang (Univ of Texas-Austin,
Zhengfang Qian (Motorola,
Jianmin Qu (Georgia Tech,

AMD Creates a New Technical Committee on Integrated Structures

The Executive Committee of the Applied Mechanics Division has recently created a Technical Committee on Integrated Structures.

The Field
Devices in advanced technologies often have complex architectures, hybrid materials, and small features. Examples include integrated circuits and thermal barrier coatings. The mechanical behavior of such integrated structures often affects their fabrication and durability. By the very nature of integrated structures, the field is cross-disciplinary, involving many materials (metals, ceramics, polymers, semiconductors, etc.), and many modes of response (fracture, deformation, instability, and mass transport). The field is extremely active, both in terms of industrial applications and academic research.

The People
Many people with advanced degrees in applied mechanics and mechanical behavior of materials are now finding jobs in the microelectronic industry and biomedical device industry. Many of them have yet found a home society. While they interact with researchers in technical societies traditionally identified with these industries, they also interact with researchers in applied mechanics. The new Technical Committee will create a home for this group of people, and a link between applied mechanics and new, exciting applications. It will also possibly provide a way for the AMD to interact with some of the Industrial Tracks.

The Organization of the Technical Committee
To forge the link between academia and industries, the committee will have co-chairs. The initial co-chairs are
• Dr. Jun He (, of Intel Corporation. He has worked over ten years in the industry, and is an innovative researcher in the field of thermomechanical reliability. He has a strong track-record of interacting with people in universities.
• Dr. Rui Huang (, of the University of Texas, Austin. He is an energetic assistant professor in applied mechanics. He has been interacting with people in industries and government labs.